TeraSpike Defender

The TeraSpike Defender is an optional housing protecting the sensitive tip of the probe against accidential mechanical impact. The exposure of the tip can be manually adjusted from -1mm to +1mm. In the negative exposure range a direct contact of the probe-tip to a flat surface is prevented by the TeraSpike Defender housing. Optical excitation as well as visual monitoring of the tip region is not impaired by the protective structure thanks to vertically placed openings. The TeraSpike Defender can be applied to any existing or new TeraSpike probe.

SHG Unit 500

The new SHG-Unit from Protemics is an easy to operate optical module and very efficient solution to convert IR light from cost-efficient femtosecond fiber-lasers into NIR light for the high-efficiency excitation of our LT-GaAs-based TeraSpike microprobes and TeraBlast emitters.

Key benefits:
  • Recommended for TeraSpike microprobe operation with IR femtosecond lasers
  • High power conversion efficiency SHG module
  • Passive and robust design
  • Short warm-up time(10-15 min)
  • Can be configured for free-space (-FS) or fiber-coupled input beams (-FC)
  • Easy to use and integrate

SHG Unit scheme

Technical specifications:
Type SHG-Unit TD-1550-NLO (-FS/-FC)
 Input wavelength range 1500 .. 1600 nm
 Typ. average input power range 30 .. 200 mW
Typ. power conversion efficiency (a) 10 .. 50% (a)
Min. aperture diameter ca. 10 mm
Dimension (l x d) 120 mm x 45 mm


For more information please refer to our product brochure (2 MB PDF-file) or contact us.


The TeraSpike Phantom is a dummy device for the replacement of a microprobe during construction work and system development. The use of the TeraSpike Phantom - as also included in the starter kit - is recommended to avoid the risk of an uncontrolled mechanical impact in critical working situations.

The following accessory is offered.

Cabel Adapt

TS cable

SMP to SMA connection cable plus SMA-to-BNC adapter (also included in the starter kit).

EDT P TTT small

Target design model: P-TTT-2-1200

The test target P-TTT-2-1200 has been specially developed for the characterization of Terahertz imaging systems. Featuring structures and areas from 2 µm up to 8 mm of lateral size it is suited for standard diffraction-limited systems as well as near-field imaging systems with sub-wavelength resolution.

The test target is based on high-resistivity silicon and contains conductor areas with three different transmission strengths beside uncoated substrate areas with maximum transmission. The featured structures include classic resolution test structures such as orthogonal pairs of three stripe structures, a Siemens star and concentric rings. These typical structures are accompanied by further structures specially useful for near-field imaging purposes such as metamaterial structures generating local field confinement. Additionally, areas helpful as references for sheet resistance imaging and wafer scanning applications are also listed.


Design scheme P TTT 2 1200


Substrate material

High-resistivity FZ silicon, 2-side polished

Substrate Resistivity

> 10 kOhm cm

Target overall size 2" x 2" (50 mm x 50 mm)

Substrate thickness

525 µm

Coating materials

Cr, Au

Coating thickness

Cr: 10 nm, 50 nm and 60 nm (in semi-transparent areas)

Au: 50 nm (opaque)

Orthogonal pairs of three stripe structures 

2 – 1200 µm wide lines & spaces

45° rotated for 2 - 460 µm wide line & spaces

Siemens star

6 mm outer diameter, 18 elements

Inverted Newton rings

5.6 mm outer diameter

Ring widths from 10 – 500 µm in increasing steps

Continuous Rsh Reference areas

Four areas, each 6.7 mm x 8.3 mm

Tilted metal grating areas

Six areas, each 2 mm x 6.7 mm

Tilting angles: 0°, 18°, 36°, 54°, 72°, 90°

Bow-tie array metamaterial

300 µm length, 5µm gap

Asymmetric double slit array metamaterial

3 µm and 6 µm slit width and spaces