Sub-system D-B2 is a vertical breadboard platform holding the core module D-B1 as well as further beam guiding components. It is offering enough space for additional components such as a CCD camera for probe-tip monitoring or a distance sensor for the sampling of profiled or tilted sample surfaces.
- Motherboard including sub-system D-B1 in customized height
- Assembly brackets
- 2 alignment apertures
- 2 tilt mirrors
- Extendable with further components such as CCD camera and distance sensor
- Sub-D-B2-CAM: Integrated CCD microscope camera system with variable illumination for monitoring of probe-tip to sample surface approximation and sample positioning
Exemplary CCD camera image of a TeraSpike microprobe tip above sample microstructure.