Sub-systems

The integration of TeraSpike microprobes into existing optoelectronic set-ups is simplified through the use of standardized optical mounting components and the following sub-systems featuring further basic funtions.

 

 

Sub-system D-B1-TR

Sub-D-B1-TR

The core sub-system D-B1-TR is a mini-board module with pre-aligned opto-mechanical components for the system integration of the TeraSpike transceiver microprobe series (TR).

Functions:

  • Microprobe fixation
  • Manual beam-to-microprobe focusing (for two beams)
  • Manual beam-to-microprobe alignment (for two beams)
  • Manual microprobe height variation
 

 

 

Sub-system D-B1

Sub-D-B1 w sd-tags-500n

The core sub-system D-B1 is a mini-board module with pre-aligned opto-mechanical components for the system integration of TeraSpike microprobes

Functions:

  • Microprobe fixation
  • Manual beam-to-microprobe focusing
  • Manual beam-to-microprobe alignment
  • Manual microprobe height variation
 

 

 

Sub-system D-B2

Sub-D-B2-650

Sub-system D-B2 is a vertical breadboard platform holding the core module D-B1 as well as further beam guiding components. It is offering enough space for additional components such as a CCD camera for probe-tip monitoring or a distance sensor for the sampling of profiled or tilted sample surfaces.

Content:

  • Motherboard including sub-system D-B1 in customized height
  • Assembly brackets
  • 2 alignment apertures
  • 2 tilt mirrors
  • Extendable with further components such as CCD camera and distance sensor

Optional extension:

  • Sub-D-B2-CAM: Integrated CCD microscope camera system with variable illumination for monitoring of probe-tip to sample surface approximation and sample positioning 

dual light cam extension sample image 300Exemplary CCD camera image of a TeraSpike microprobe tip above sample microstructure.